http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-210514408-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1694448734446c1590fe7e3ff68cccc2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2019-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43406ac3aa6b1b59f7fc714887702b6c |
| publicationDate | 2020-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-210514408-U |
| titleOfInvention | High-frequency test probe card |
| abstract | The utility model relates to a high frequency test probe card, including PCB board and probe, the probe includes body and needle point, type "L" type structure is constituteed to body and needle point, the body of probe is fixed on the PCB board through electrically conductive adhesive bonding. The utility model adopts the conductive silver adhesive to bond and fix the probe on the PCB, the whole structure is simpler, the whole path from the probe point to the joint of the PCB is shorter, and the testing frequency is improved; the probe is fixed without a ceramic carrier, so that the manufacturing cost and time of the ceramic carrier are saved; the probe is directly fixed on the PCB by the conductive silver adhesive, and the connection and conduction effects are directly realized, so that the subsequent welding link is omitted, and the manufacturing efficiency is improved. |
| priorityDate | 2019-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419557109 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23954 |
Total number of triples: 14.