http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-210469859-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4753ed6ebdfa3cdd53d8272aacd54289 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 2019-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_426b8d295bcc4e4d1fa18b7054bfbdba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a01aac0308a103dd06883292c1e9bba |
| publicationDate | 2020-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-210469859-U |
| titleOfInvention | Double-sided heat dissipation assembly with moisture-proof function |
| abstract | The utility model relates to a double-sided heat radiation component with moisture-proof function, which comprises a top heat radiation part, a moisture-proof sealing ring, a bottom heat radiation part, silicon rubber and a chip circuit board formed by welding a chip on the circuit board; the bottom heat dissipation part is provided with a first metal plate and fins erected on the bottom surface of the first metal plate, the moisture-proof sealing ring is fixed on the top surface of the first metal plate, the middle part of the moisture-proof sealing ring is provided with a groove penetrating through the body of the moisture-proof sealing ring from top to bottom, the top heat dissipation part is provided with a second metal plate and fins erected on the top surface of the second metal plate, and the second metal plate covers the groove to form a closed space; the chip circuit board is positioned in the closed space, the bottom surface of the chip circuit board is adhered to the top surface of the first metal plate through silicon adhesive, and the top surface of the chip circuit board is adhered to the bottom surface of the second metal plate through silicon adhesive; the heat dissipation assembly is characterized by further comprising a through hole penetrating from the closed space to the outside of the heat dissipation assembly, the electric wire on the chip circuit board is led out of the heat dissipation assembly through the through hole, and sealant is filled in the hole of the through hole so as to seal the closed space. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111889922-A |
| priorityDate | 2019-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.