| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73e2edff8c04f468cddb7feb8c0aa1e3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10356 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B7-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-328
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-111 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate |
2019-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2952d60f0b2899df803c5c5cb800662d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f093d929836a0e57cf05d73dbf601d7b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a914d1e508527be9539bfb5dfdf5a98 |
| publicationDate |
2020-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-210137508-U |
| titleOfInvention |
Printed circuit board assembly |
| abstract |
A printed circuit board assembly is provided. The cable has a plurality of conductors of a first thickness and the electronic device has a plurality of metal pads of a second thickness. The method includes removing a jacket over a plurality of conductors of the cable to expose the plurality of conductors. The method includes placing the exposed plurality of conductors of the cable on a plurality of metal pads of an electronic device. The method also includes focusing a laser beam on a portion of the plurality of conductors such that the laser beam welds each conductor to a corresponding metal pad. |
| priorityDate |
2018-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |