http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-210130028-U
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9b7355b0819967f5d5c11e1f923ec1a6 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
filingDate | 2019-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2020-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8afef046e1ceeababdd889c5d30bc768 |
publicationDate | 2020-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-210130028-U |
titleOfInvention | SIP-packaged high-voltage module |
abstract | The utility model discloses a SIP packaged high-voltage module, which comprises a shell consisting of a shielding cover and a substrate, a first component arranged inside the shell, an external packaging adhesive arranged outside the shell and an internal filling adhesive arranged inside the shell; the bottom of the first component is provided with a welding leg, the upper surface of the substrate is provided with a welding pad, and the first component is welded on the welding pad through the welding leg; the external packaging adhesive effectively isolates external water vapor and dust; the shielding cover can have the effects of heat dissipation and electromagnetic shielding; adopt special high heat conduction high insulating resin to fill in the casing, improved the utility model discloses a heat dissipation and insulating properties. |
priorityDate | 2019-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.