| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9198feafd18dc9a696eca0bd0eabe959 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0026 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-08 |
| filingDate |
2018-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2bfd71b49e7b43fc44dfd2d33b47aea9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89b9fb389418ed9efad91211265fafb6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a46472b5bfaba073b4d56061779b430 |
| publicationDate |
2020-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-209964380-U |
| titleOfInvention |
A component carrier with laser vias |
| abstract |
A component carrier (100) with laser vias, wherein the component carrier (100) comprises: i) at least one electrically insulating layer structure (102) and at least one conductive layer structure (104), wherein the conductive layer structure (104) forms in or below the electrically insulating layer structure (102), and ii) laser vias (110) formed in the electrically insulating layer structure (102) and extending down to the conductive layer structure (104), wherein the laser vias (110) ) is at least partially filled with conductive material (111). Thus, the connection diameter (CD) at the first end (120) of the laser via (110) at the conductive layer structure (104) is equal to or greater than the second end (104) of the laser via facing away from the conductive layer structure (104). Diameter of opening (OD) at end (130). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022007306-A1 |
| priorityDate |
2018-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |