http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-209861258-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0562ebe4e29987078a9c392938cf4b9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 2019-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8cd4603199ec0f7b82a955e0165c043a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d87cb7bd6d4f9334c476b2031e12b924 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d24f95f284c19ab0edda2734cace87ee http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ffd2da463f3a38fc919cb850a33c65e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12753cfa0f26aebd2bb81acca757bc9c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e5729ff28981ce246e481b531a02de4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9686fcc7b417ec78c76990f61a3eeb82 |
| publicationDate | 2019-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-209861258-U |
| titleOfInvention | Module circuit |
| abstract | The technical scheme of the utility model a module circuit is provided, include: a PCB board; the PCB comprises a PCB and a plurality of electronic components, wherein the PCB is provided with a first surface and a second surface, the first surface is provided with a plurality of electronic components, the plurality of electronic components are provided with grounding contacts, the grounding contacts penetrate through the first surface, the PCB extends to the second surface in a protruding mode, and the metal heat conduction module is connected with at least two grounding contacts of the electronic components. The utility model discloses an increase metal heat conduction module, on conducting the heat total that produces among the module circuit to the ground contact as far as possible, on further high thermal conductivity through metal heat conduction module concentrates the metal module with the heat of dispersion on the ground contact on the circuit board, the rethread metal module is derived the heat with casing in close contact with's mode. The utility model discloses a module circuit, it is efficient at during operation heat conduction, and simple structure, easily industrial production. |
| priorityDate | 2019-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.