http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-209298149-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e0e1631f29ba5e336de0593e4e7ee497 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0236 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B33-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-18 |
| filingDate | 2018-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_066047901b7d18a747b47eddff6832ca |
| publicationDate | 2019-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-209298149-U |
| titleOfInvention | A diamond wire cut silicon wafer pretreatment equipment |
| abstract | The utility model discloses a silicon chip pretreatment device for diamond wire cutting, which comprises a cavity body, one or more groups of plasma generators, a transmission system and a waste gas discharge system; the plasma generator is installed on the upper end surface of the upper cavity body The exhaust gas discharge system is connected to the lower end surface of the cavity and communicated with the cavity; the transmission system passes through the openings on the left and right sides of the cavity and extends to both sides; the copper coil is excited by a radio frequency power supply , to generate electromagnetic oscillations, the etching gas is passed into the quartz reaction chamber through the gas pipe, and after mixing, it is excited by the radio frequency power supply to form plasma. When the silicon wafer passes below, the surface of the silicon wafer is etched, leaving uniform and fine particles on the surface of the silicon wafer Defects, these defects continue to corrode in the back of the texturing tank and enlarge into a textured structure, which makes the texturing effect better in the later stage, can reduce or replace the texturing additives, reduce the cost of texturing and wastewater treatment, and improve the conversion efficiency of cells. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109585608-A |
| priorityDate | 2018-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.