http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-208570588-U

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f8b60d0adf0017712aa2eac23d18d45d
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
filingDate 2018-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a9d987f706dae5ad30b638325c48053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82345777a6c13664cc9af130610ef9d0
publicationDate 2019-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-208570588-U
titleOfInvention A kind of semiconductor crystal wafer encapsulating structure
abstract The utility model discloses a kind of semiconductor crystal wafer encapsulating structures, including circuit board, fixed plate, pin and semiconductor, through-hole is offered in the circuit board and fixed plate, the fixed plate is located at the lower end of circuit board, and the surface area of fixed plate is less than the surface area of circuit board, the upper surface of the circuit board is fixed with fixing sleeve, through-hole on the circuit board is located at the inside of fixing sleeve, the fixing sleeve internal screw thread is equipped with protective case, the height of the fixing sleeve is less than the height of protective case, and protective case is located at the inside of fixing sleeve, the lower end surface both ends of the semiconductor are respectively and fixedly provided with pin, the pin is mounted on circuit board and fixed plate by through-hole, the diameter of the semiconductor is less than the inside diameter of protective case, and semiconductor is located at the inside of protective case, the lower end of the pin is socketed with insulation sleeve, the insulation sleeve position In the lower end of fixed plate.The effect that the utility model is conducive to the fixation to semiconductor and insulate to pin lower end.
priorityDate 2018-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21225539
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID448085246

Total number of triples: 16.