http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-207820316-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e2e4ab988e33ff056c082e2b24945493 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate | 2018-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f1b05bdf7e59e9f3d4ca52447c218f9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7f3b44ad41b4907d767d566b559214b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b355507a99ca2aedc07a996dcfea59b5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d77140765f1900d62bfe74d56bb7c8c |
| publicationDate | 2018-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-207820316-U |
| titleOfInvention | Multilayer impedance circuit board with hole-in-hole shielding effect |
| abstract | The utility model proposes a multi-layer impedance circuit board with a hole-in-hole shielding effect, which includes a first layer, a second layer, a third layer and a fourth layer, and passes through the first layer, the second layer, the third layer and the The ground hole of the fourth layer, the first layer and the fourth layer are provided with impedance-controlled high-speed signal lines, and the first copper sink layer, the first electroplating layer and the resin are arranged in the ground hole in sequence, and the resin is opened There is a small hole, and the small hole communicates with the impedance-controlled high-speed signal line of the first layer and the fourth layer, and the second copper sinking layer and the second electroplating layer are arranged in the small hole in turn; the first layer and the second layer A first guide hole for communication is provided between the layers, and a second guide hole for communication is provided between the third layer and the fourth layer. The utility model proposes a multi-layer impedance circuit board with a hole-in-hole shielding effect, and simultaneously has hole wall-to-ground shielding, same-layer to-ground shielding and different-layer to-ground shielding. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113784497-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113784497-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109561571-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109561571-B |
| priorityDate | 2018-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.