http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-205571734-U
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cf5cff330c06673e339c1d0c990871b3 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-70 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-38 |
filingDate | 2016-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2016-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5070ec32646825993a5e2a08bdf42407 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d4a5349a4e50f9ecbb61f6e652d1ff7 |
publicationDate | 2016-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-205571734-U |
titleOfInvention | System for become LOGO at sapphire surface preparation CD line and laser cutting |
abstract | The utility model provides a system for become LOGO at sapphire surface preparation CD line and laser cutting, system of processing includes: a spin -coating even machine of gluing, a step -by -step lithography machine includes: and the column pitch the control unit and the exposing unit that arrange, a developing machine, plasma dry etching machine, a laser cutting machine. The CD line material that system of processing obtained is the sapphire, belongs to to go out the CD line at sapphire surface finishing, and the CD line that forms does not drop, is difficult for the fish tail, and wafer edge ablation region is less than 20um after the cutting of high power laser. |
priorityDate | 2016-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Predicate | Subject |
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isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23931 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419556032 |
Total number of triples: 15.