http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-205376520-U

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c7174ca4f745a74e9dfbe2a5266182fe
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
filingDate 2016-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2016-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24c927da0b004702b85cd7b383e7f824
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b34fdb43ac00743dc2cc3055dd7ed2b9
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publicationDate 2016-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-205376520-U
titleOfInvention Three -dimensional integrated sensor chip package module
abstract The utility model discloses a three -dimensional integrated sensor chip package module belongs to fields such as integrated circuit package, sensor technology. The utility model discloses a three -dimensional integrated sensor chip package module includes: sensor chip, sensor chip's upper surface has sensor elements array and pad, sensor chip's lower surface is equipped with the slot, grooved surface is equipped with passivation layer and conducting layer, application specific integrated circuit chip configuration in the ditch inslot of sensor chip lower surface, and dispose on the conducting layer of sensor chip slot, plastic package material. The utility model discloses a not only reduced the size of encapsulation, realized the three -dimensional integrated of the single encapsulation module of multicore piece simultaneously, avoided moreover because the reliability problem that arouses at sensing chip edge preparation step or recess.
priorityDate 2016-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 23.