http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-205159310-U
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_55d966dbbda7be8bc053d82b47b8555a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485 |
| filingDate | 2015-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e76ce61041644707ee406b82f402fb3 |
| publicationDate | 2016-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-205159310-U |
| titleOfInvention | Low -cost palau IC encapsulation lug |
| abstract | The utility model discloses a low -cost palau IC encapsulation lug, include from the carrier, conducting layer, insulating layer, palladium layer and the gold layer that upwards set up down, be equipped with the hole on the insulating layer, expose partial conducting layer, still include to follow upwards to set up titanium layer and the copper layer between insulating layer and palladium layer down, titanium layer lower surface limit portion laminating insulating layer upper surface, middle part pass the partial conducting layer of hole laminating, copper layer lower surface laminating titanium layer upper surface, upper surface laminating palladium layer lower surface. The utility model discloses a titanium layer replacement is sputtered UBM titanium tungsten layer and is replaced sputtering the golden layer conduct metal bonding layer of UBM as hindrance layer, adoption copper layer, and the metallic titanium is more much lower than the price of tungsten, still save the input of titanium tungsten alloy processing, and metallic copper and metal palladium is also more much lower than metal price of gold check to the cost of product has effectively been reduced, the titanium layer sputters the in -process at physics and is difficult to produce small granule, the etching noresidue at harvest time, and the yield is more than 99%. |
| priorityDate | 2015-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.