| abstract |
A kind of fingerprint recognition chip-packaging structure, encapsulating structure comprises: substrate; Be coupled in the induction chip of substrate surface, described induction chip has first surface and the second surface relative with first surface, and the first surface of described induction chip has induction zone, and the second surface of described induction chip is positioned at substrate surface; At least be positioned at the upper cap rock on the surface, induction zone of induction chip, the material of described upper cap rock is polymer; Be positioned at the plastic packaging layer on substrate and induction chip surface, described plastic packaging layer exposes described upper cap rock.Described encapsulating structure can reduce the requirement of induction chip sensitivity, applies more extensive. |