http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-203537664-U

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3c5865fbce2be20eac71427f23459278
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
filingDate 2013-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ade9fa79a37edcf21f1835ef0f3e5fba
publicationDate 2014-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-203537664-U
titleOfInvention Multilayer circuit board based on insulating base paper
abstract The utility model discloses a multilayer circuit board based on an insulating base paper. The multilayer circuit board comprises an insulating substrate and a metal coating, wherein the insulating substrate includes a first insulating print paper, a second insulating print paper, a third insulating print paper, a fourth insulating print paper and a fifth insulating print paper, and the fifth insulating print paper is coated by a phenolic resins layer. Each insulating print paper is provided with K matrixes and B matrixes. An up-sloping part and a vertical part of the K matrix are connected, and a down-sloping part of the K matrix begins from the up-sloping part and breaks away from the vertical part. The distance between the K matrix and the B matrix is 0mm. According to the multilayer circuit board provided by the utility model, the seven insulting layers of the insulating substrate is reduced to five layers, and the gel content of resin is reduced by about 20-30%, thereby greatly reducing the production cost.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105430875-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105430875-A
priorityDate 2013-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 19.