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filingDate 2021-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec6e8c4fb4f7c41540f3c311cdf1e774
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publicationDate 2022-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-115428172-A
titleOfInvention Light-altering material arrangement for light-emitting devices
abstract Solid state lighting devices and more particularly light emitting devices are disclosed, including light emitting diodes (LEDs) having an arrangement of light altering material (20). The LED device (10) may include a light-altering material (20) disposed around the peripheral sidewall (12c) of the LED chip (12) without a support mount or lead frame. A light-altering material (20) of reduced thickness may be provided along the peripheral sidewall (12c) of the LED chip (12). The exemplary LED device (10) disclosed herein can be configured with a footprint that approximates the footprint of the LED chip (12) within the LED device (12), and can also provide a certain amount of space around the peripheral edge of the LED chip (12). The amount of light alters the material (20) to reduce crosstalk. Accordingly, such LED devices (10) may be well suited for applications where the LED devices (10) form arrays of closely spaced LEDs. A fabrication technique is disclosed that includes laminating a preform of light modifying material on one or more surfaces of an LED chip (12).
priorityDate 2020-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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