| abstract |
The present invention provides a sheet for manufacturing a semiconductor device comprising a substrate, an adhesive layer, an intermediate layer, and a film-like adhesive, wherein the sheet for manufacturing a semiconductor device is formed by sequentially laminating the adhesive layers on the substrate. , the intermediate layer and the film-like adhesive, the intermediate layer contains a non-silicon resin with a weight average molecular weight of 100,000 or less as a main component, the base material and the adhesive layer having a The maximum cross-sectional height of the surface on the opposite side is 2000 nm or less. |