| abstract |
To provide an active ester capable of exhibiting excellent flexibility and low dielectric properties in a cured product, a curable resin composition containing the above-mentioned active ester, and a cured product obtained by using the above-mentioned curable resin composition, and further to provide a product using A semiconductor sealing material, a semiconductor device, a prepreg, a flexible wiring board, a circuit board, a laminate film, a laminate substrate, a fiber-reinforced composite material, and a fiber-reinforced resin molded product of the curable resin composition. The present invention relates to an active ester, characterized in that it has a structure in which a residue (A) of a polyol compound and a residue (Q) of an aromatic polycarboxylic acid are bonded via an ester bond, and the active ester is The ester is capped with the residue (C) of a mono-terminal aromatic hydroxyl group-containing compound. |