http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115190695-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80fa1263dd855908f4c4d0d7ed2d8b1c |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2022-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51ef7d3fa4b316fecbd059785b2dcd4f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8be5be4aee1a2009252722ccfa01ff83 |
| publicationDate | 2022-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-115190695-A |
| titleOfInvention | A kind of glass substrate double-sided conduction microcircuit processing method |
| abstract | A method for processing a double-sided conducting microcircuit on a glass substrate, comprising the following steps: firstly, attaching the glass substrate surface I to the carrier plate I through an adhesive composition; secondly, using laser drilling and chemical etching to make through-holes The micropores of the glass substrate are filled with metal and/or conductive paste; three, a metal/alloy film layer is deposited on the surface II of the glass substrate, and a photolithography process is performed on the surface II of the glass substrate to form a microcircuit; Fourth, attach the glass substrate surface II to the carrier plate II through the adhesive composition, and separate the carrier plate I from the glass substrate surface I through ultraviolet light irradiation and/or heat treatment; Fifth, deposit on the surface of the glass substrate surface I Metal/alloy film layer, a photolithography process is performed on the glass substrate surface I to form a microcircuit; six, ultraviolet light irradiation and/or heat treatment, so that the glass substrate surface II and the carrier plate II are separated to obtain a glass substrate; thus, in the During the production and processing process, the product is not easy to break; thus improving the production efficiency and reducing the cost. |
| priorityDate | 2022-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 90.