http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115161722-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a8160e834241de345c4f85aae1aa3407 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-126 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate | 2022-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_460648e00fe5f1681fcddacdd8d5cbfb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20797febcbe3cb460d81c85701d0d7aa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_377ad879dae21cf6ab694d19771a5275 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d3321c613b36786e813de704c329fa8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0be56877ba951288585928147eb88b03 |
| publicationDate | 2022-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-115161722-A |
| titleOfInvention | Nickel plating solution and preparation method thereof, and preparation method of solar cell |
| abstract | The embodiments of the present application provide a nickel plating solution, a method for preparing the same, and a method for preparing a solar cell. In parts by weight, the nickel plating solution includes: 30-40 parts of nickel-containing main salt, 10-20 parts of conductive salt, 1-2 parts of buffer, 0.5-1 part of anode activator, 0.1-0.2 part of wetting agent, water 900 to 1000 copies. The nickel plating solution provided by the embodiments of the present application can be used to form a nickel layer on a substrate during the preparation process of a solar cell. The electrodes of the battery are not easily separated from the substrate. In addition, since a wetting agent is added to the nickel plating solution of the embodiment of the present application, the wetting agent can change the surface tension of the substrate, and in the process of nickel electroplating, the generated hydrogen gas bubbles can be separated from the surface of the substrate as soon as possible, avoiding the plating The nickel layer is discontinuous, thereby improving the electrical properties of the nickel layer. |
| priorityDate | 2022-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.