| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2463-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2022-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b88ec7fdfbad0e6021c45882fbe661e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bda01b5f2f9c048683a900cb34ede4e |
| publicationDate |
2022-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-115135038-A |
| titleOfInvention |
Manufacturing method of printed wiring board |
| abstract |
The subject of this invention is to provide the manufacturing method of the printed wiring board which can suppress the generation|occurrence|production of the crack after desmear process (roughening process). The solution of the present invention is a method for producing a printed wiring board, which includes (A) thermally curing the resin composition layer of the laminate having an inner layer substrate and a resin composition layer bonded to the inner layer substrate in order, The step of forming an insulating layer with a glass transition temperature of T 1 (° C.), (B) the step of subjecting the insulating layer to heat treatment at T 2 (° C.), and (C) Desmearing the insulating layer with an oxidizing agent solution The step of treatment; the resin composition layer contains an epoxy resin and an active ester-based curing agent, and satisfies the following formulae (1) and (2) at the same time. ‑20≤T 1 ‑T 2 ≤20 (1)60≤T 2 ≤150 (2). |
| priorityDate |
2021-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |