http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115124763-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fbe486283ab939aa267fa0320eef3303 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 |
| filingDate | 2022-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1414bb9e42d36e6f5f3f4ade65c65191 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4feba5b0274d7e7265722be8c76379c6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_944e70aae71472a1fdd30eceb448e735 |
| publicationDate | 2022-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-115124763-A |
| titleOfInvention | A kind of production process of high thermal conductivity spherical filler |
| abstract | The invention discloses a production process of a spherical filler with high thermal conductivity, belonging to the technical field of thermal conductive materials. -40 parts of hexagonal boron nitride powder with an average particle size of 1-5 microns, 1-10 parts of nano-zinc oxide powder, 1-5 parts of nano-yttrium oxide powder, 1-5 parts of magnesium oxide, 98 parts of alcohol, 2 parts of polyvinylpyrrolidone Resin and 1 part of anionic polymer dispersant; in the present invention, the actual measurement and comparison found that the maximum filling amount of commercially available aluminum nitride with an average particle size of 1 micron in 500 viscosity silicone oil is 65% (weight parts), and the average particle size is The maximum filling amount of 3 micron boron nitride in 500 viscosity silicone oil is 50%, the high thermal conductivity filler powder has stable chemical properties, water resistance, good fluidity, large filling amount in organic resins, low density, small specific surface area, low Dielectric constant, suitable for high thermal conductivity silicone, structural adhesives and thermally conductive plastics. |
| priorityDate | 2022-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.