http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115119411-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36eb9f47df84e6beac95e1d28828f97a |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-328 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 |
| filingDate | 2022-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc75f19a6c0b204795f09b06a8f66a21 |
| publicationDate | 2022-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-115119411-A |
| titleOfInvention | A kind of package body without stencil printing welding method and prefabricated substrate |
| abstract | The application of the present invention discloses a method for welding a package body without stencil printing and a prefabricated substrate, including step 1: providing a carrier board; step 2: prefabricating a circuit and an insulating layer on the surface of the carrier board; step 3: electroplating on the insulating layer The pads that are electrically connected to the prefabricated circuit are encapsulated and ground to expose the side of the pads away from the carrier. The roughness of the grinding ranges from 200 to 500 mesh to facilitate the movement of the printing scraper; Step 4: Place the pads on the The pits are formed by full etching, and the anti-oxidation layer is formed at the pits and then stored for use; step 5: use a printing machine to print solder on the pits, flip the chip and fix it by welding, and finally peel off the carrier board, the present invention The application eliminates consumables such as stencils, saves costs, simplifies the printing mechanism of the printing machine, does not have a stencil mechanism, reduces equipment costs and maintenance costs, so the application is suitable for high-precision printing of large-sized substrates without large-scale offsets Caused by printing offset and inaccurate positions. |
| priorityDate | 2022-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.