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filingDate 2022-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c418e4e34fb4531ab015dd7464403b1e
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publicationDate 2022-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-115101489-A
titleOfInvention Shallow cooling integrated package structure for high thermal efficiency photodetector
abstract The invention relates to a shallow refrigeration integrated package structure of a photodetector with high thermal efficiency, comprising an integrated integrated tube shell, the lower end of the integrated integrated tube shell is fixedly connected with a low thermal resistance heat sink, and the top of the low thermal resistance heat sink is connected There is a multi-stage tower-type TEC; a cavity is arranged inside the integrated tube shell, and the multi-stage tower-type TEC is located in the cavity; A light-transmitting hole is opened in the middle of the upper end face of the integrated tube shell; a light window covering the light-transmitting hole is arranged on the upper end of the integrated tube shell. The invention realizes a high thermal efficiency photoelectric detector shallow refrigeration integrated packaging scheme, improves the thermal efficiency of the photoelectric detector refrigeration, expands the refrigeration temperature range, reduces the packaging volume, reduces the packaging cost, and increases the device life. More suitable for chips that require shallow cooling and long life.
priorityDate 2022-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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