http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115083990-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ac31afbea1cbbb03498644721ffb4a62 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68368 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-075 |
| filingDate | 2022-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d027d98f7deb7128d9074e4d4d02989f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed30439c9275d4340e076d147486bc62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e693bbf89f585cbc81db86b113801b1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5f7d3a07bd641302c4ee83e0c2d2500 |
| publicationDate | 2022-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-115083990-A |
| titleOfInvention | Micro-LED Mass Transfer Method |
| abstract | The invention discloses a Micro-LED mass transfer method. First, a Micro-LED array on a conventional substrate is prepared. After that, the photosensitive tape is bound to the chip, and the chip is separated from the original substrate. Then, the photosensitive tape is irradiated with light to lose its adhesiveness, and then the transfer substrate is aligned with the chip to be transferred for chip pickup. The drive circuit is evaporated on the receiving substrate, and the low melting point metal solder joint is evaporated. Then, the transfer substrate with the chip is aligned with the target substrate, and pressure is applied to make the chip closely adhere to the substrate, and then the heat release adhesive on the transfer substrate loses its viscosity and melts the solder joints. Finally, return to normal temperature and remove the transfer substrate to complete the transfer of the chip. The invention can release the chip and the welding of the chip at the same time, thereby improving the efficiency of chip transfer, and at the same time, it can transfer chips with different pitches and sizes by controlling the pattern of the heat release adhesive on the transfer substrate. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-116387419-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-116387419-A |
| priorityDate | 2022-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.