http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115083652-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b2d16386dbd8a639719ee3f3362ea16a |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H85-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H85-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 |
| filingDate | 2022-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c4e65181dbcfdc3ef249464ef689364 |
| publicationDate | 2022-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-115083652-A |
| titleOfInvention | Conductive paste and electronic component for forming high-density film after sintering |
| abstract | The invention provides a conductive paste and an electronic component for forming a high-density film after sintering, wherein the conductive paste includes the following components: A. an organic carrier, and the organic carrier includes a first organic solvent; B. a metal-organic compound solution, The metal-organic compound solution includes a second organic solvent and a metal-organic compound that can be dissolved in the first organic solvent and the second organic solvent; the metal-organic compound includes: a first metal-organic compound that generates a conductive phase, and a second metal that generates a binding phase Organic compounds and the third metal-organic compound that acts as a fire inhibitor. The conductive paste provided by the present invention is characterized in that it contains metal-organic compounds fused with the organic solvent in the paste. The metal-organic compounds are decomposed and reduced during sintering to form a dense and flat conductive film, and the decomposed components can be combined with The substrate forms a bond, and the conductive paste further contains an additive that effectively prevents excessive sintering shrinkage of the conductive phase in the paste during high-temperature sintering. |
| priorityDate | 2022-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.