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filingDate 2022-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6b57af598fcf98b2510b7314b90af7c
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publicationDate 2022-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-115078213-A
titleOfInvention Microfluidic chip for simulating multi-fissure pore structure and fabrication method
abstract The invention discloses a microfluidic chip for simulating a multi-fissure pore structure and a manufacturing method. The microfluidic chip comprises a chip main body, a silicon substrate layer is arranged on the chip main body, and a silicon substrate layer is arranged on the silicon substrate layer. An etching area simulating multiple fissures and pores, a non-etching area located around the etching area, and a mineral coating is provided on the surface of the etching area and the non-etching area on the silicon substrate layer, so The mineral coating is provided with a borosilicate glass cover layer, the chip body is provided with a number of injection ports and injection ports, and the longitudinal extension directions of the injection ports and the injection ports are all perpendicular to the silicon substrate. The sheet layer and the mineral coating, the plurality of injection ports and the injection ports are respectively communicated with external channels. The invention fills the blank of the application of the microfluidic technology in the double-fissure pore structure, can be widely used in the field of energy and environment, and has the potential to expand to the fields of biomedicine, experimental fluid mechanics and the like.
priorityDate 2022-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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