| abstract |
The application provides a resin composition, a compound, a prepreg, an electric copper clad laminate, a preparation method and an application thereof, and relates to the technical field of polymer materials. The resin composition includes the following components in parts by mass: BVPE compound 10 ~30 parts, 40-80 parts of polyphenylene ether resin, and 0.01-3 parts of initiator, wherein the BVPE compound is selected from one or more of modified or unmodified BVPE polymers. The present application also provides a preparation method of the resin composition, a BVPE compound, a preparation method of the BVPE compound, a prepreg based on the resin composition, an electric copper clad laminate and a preparation method thereof. The present application provides a resin composition that can improve the dielectric properties and heat resistance of products, and its application in circuit boards such as prepregs and electrical copper clad laminates, and has broad application prospects. |