| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68368
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-416
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-30 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate |
2021-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5040f708f83a5298a98d1e2404a548e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42577864a25badce2169c20e70126e20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48b48e6d3663aa6a6fa40fd060c01aac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2de109cc58448f0690a01edbb31a1d7 |
| publicationDate |
2022-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-114981928-A |
| titleOfInvention |
The method of peeling off the adherend |
| abstract |
The present invention relates to a method of peeling off an adherend, a method of manufacturing a semiconductor chip including a step of performing the peeling method, and a method of manufacturing a semiconductor device including a step of performing the peeling method, the peeling of the adherend The method includes: step (S1): a step of bonding a plurality of adherends to the pressure-sensitive adhesive layer (X1); and step (S2): bonding a part of the plurality of adherends A step in which at least a part of the pressure-sensitive adhesive layer (X1) in the region of the adherend is sublimated to generate gas to reduce the adhesive force between the partial to-be-adhered body and the pressure-sensitive adhesive layer (X1). |
| priorityDate |
2020-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |