http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114967340-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0e3b235b333453465eac0b462b7e31eb |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate | 2021-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4329f65d7e35ea2151d994180bb88b58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b76743290f813e9949d62dfce75729f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f82c865d5c929599a4877ba6da844826 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c2a72287b27d2a78e211bff44d56832 |
| publicationDate | 2022-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114967340-A |
| titleOfInvention | Polypeptide-type negative thick-film photoresist and method of making and using the same |
| abstract | The invention provides a polypeptide-type negative thick-film photoresist and a method for preparing and using the same. The photoresist, calculated in weight percentage, comprises: polypeptide gelatin, 10% to 50%; ferric ion-containing photosensitizer, 0.5%～5%; polymer crosslinking agent, 1%～5%; leveling agent, 100ppm～3000ppm; solvent, balance. The polypeptide-type negative thick-film photoresist has a large molecular and cross-linking degree after curing under light, and the photoresist has good wettability, so for holes with a high aspect ratio, the filling quality is greatly improved. , significantly reducing the possibility of bubbles generated during the filling process, effectively improving the uniformity of the photoresist gap filling performance, and the molecules and cross-linking degree after the photoresist is cured, which can effectively improve the photolithography in high aspect ratio holes. The insulating properties of the glue; it can be prepared and processed in an aqueous solution, thereby eliminating the need for organic solvents, eliminating the need for explosion-proof treatment equipment and exhaust hoods for organic solvents, and storage and disposal of waste solvents, which are environmentally friendly photoresist. |
| priorityDate | 2021-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.