| abstract |
The present invention provides a prepreg coating material, a prepreg and a copper clad laminate. The prepreg coating material includes a resin composition comprising a predetermined content of epoxy resin, curing agent, cyanate ester resin, bismaleate The composition of imide resin and liquid resin containing unsaturated double bonds enables the prepreg coating material to have high heat resistance, high toughness, high bond strength, high oxidation resistance, low thermal shrinkage and low dielectric properties Effect. The prepreg adopts the prepreg coating material provided by the present invention as the prepreg coating, and has good heat resistance and adhesion. The copper clad laminate adopts the prepreg provided by the present invention, which has the effects of low glue spillage, high peel strength, high tin immersion heat resistance, high bending strength, high tensile strength and low thermal shrinkage rate. |