Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53228 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
filingDate |
2021-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d9e5fd1f57a4b4991a1343278a8de4d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ef0bfb838c9f3b1327d76ee22f743b9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0aa2f55668c38f50cd310f6766578442 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73d9fa96fae3d2d27bb64b7a8fb158bf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7e729384e1d300b6f732884f017d765 |
publicationDate |
2022-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-114930502-A |
titleOfInvention |
Improve TSV processing window and fill performance through long pulse and ramping |
abstract |
A method of electroplating metal into features of a partially fabricated electronic device on a substrate having a high open area portion is provided. The method includes initiating a bulk electrofill phase with a pulse at a high current level; reducing the current to a baseline current level; and optionally increasing the current in one or more steps until electroplating is complete. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-116682785-A |
priorityDate |
2020-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |