http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114902388-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81193 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-95053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-95001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-677 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-677 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
| filingDate | 2021-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdf47da07c6bafd1f0c2804b4758434c |
| publicationDate | 2022-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114902388-A |
| titleOfInvention | Manufacturing method of electronic component, and manufacturing method of display device |
| abstract | An object of the present invention is to provide a method for producing an electronic component which transcribes a chip component onto a drive circuit board from a transfer laminate in which a chip component is placed on a transfer substrate having an adhesive layer. The manufacturing method of the electronic component of the invention can reduce the residue of the adhesive layer and transfer the chip component with a good yield. Moreover, the objective of this invention is to provide the manufacturing method of a display device including the manufacturing method of this electronic component. The present invention relates to a method for producing an electronic component, the method comprising: bringing a laminate for transfer, in which chip components are arranged on a substrate for transfer having an adhesive layer containing a gas generating agent, and a drive circuit substrate close to it, Step (1) of aligning the position of the chip component and the drive circuit board; and applying stimulation to the pressure-sensitive adhesive layer containing a gas generating agent to transfer the chip component from the transfer laminate Step (2) of printing on the drive circuit substrate. |
| priorityDate | 2020-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 152.