http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114864511-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0bb8b1b6b4acc7de6d137f47dd491b22 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-56 |
| filingDate | 2022-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8cd1f4122bd3d48e033b372e53639405 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d6f703c88ddac85d30cfeaa7bc5bdba |
| publicationDate | 2022-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114864511-A |
| titleOfInvention | A kind of semiconductor circuit based on glass fiber board combination process and its manufacturing method |
| abstract | The invention relates to a semiconductor circuit based on a glass fiber board combination process and a manufacturing method thereof, comprising a glass fiber substrate, a plurality of electronic components, a plurality of metal substrates, a plurality of pins and a sealing layer, wherein the glass fiber substrate is provided with A plurality of component mounting holes, the surface of the glass fiber substrate is provided with a circuit wiring layer, the power devices that generate heat in the plurality of electronic components are mounted in the component mounting holes, the surface of the power device is exposed in the component mounting holes, and the metal substrate is provided on the power device. Back; one end of the plurality of pins is electrically connected to the circuit wiring layer respectively; the sealing layer wraps at least one side of the glass fiber substrate on which the electronic components are arranged, the other end of the plurality of pins is exposed from the sealing layer, and the surface of the metal base material protrudes from the sealing layer. sealing layer. Compared with the metal substrate in the prior art, the present invention adopts a glass fiber substrate, which is widely used in the manufacture of general PCB boards, and its cost is much lower than that of the metal substrate, which can greatly reduce the cost. |
| priorityDate | 2022-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.