| abstract |
The present invention provides a protective film forming agent which is used to form a protective film on the surface of a semiconductor wafer during dicing of a semiconductor wafer, can form a protective film excellent in laser processability and is excellent in solubility of a light absorber, and uses the protective film A method of manufacturing a semiconductor chip of a film-forming agent. The protective film-forming agent contains a water-soluble resin (A), a light absorber (B), a basic compound (C), and a solvent (S). The basic compound (C) is preferably an alkylamine, an alkanolamine, an imidazole compound, ammonia or an alkali metal hydroxide. It is preferable that content of the light absorber (B) in a protective film forming agent is 0.1 mass % or more and 10 mass % or less. |