patent/CN-114823396-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114823396-A

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0479fc651a9a56a8ca904d3409c73887
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75261 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-7528 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81224 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2021-60292
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K10-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-75 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K10-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
filingDate	2022-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63ba41d9785f299a5b959190a90f3ee0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d907bf9c0a3563054c906c8f10ff398b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee8cf049c901b10158e04f64f7daef96 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e66bf82784c99b22a003c213e2c289cc
publicationDate	2022-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	CN-114823396-A
titleOfInvention	Bump forming apparatus, bump forming method, solder ball repairing apparatus and solder ball repairing method
abstract	A bump forming apparatus, a bump forming method, a solder ball repairing apparatus, and a solder ball repairing method, which aim at high reliability in the formation of extremely minute solder bumps. The bump forming apparatus of the present invention supplies solder balls to electrode pads formed on a substrate, and includes a plasma generator and a laser generator that irradiates the supplied solder balls with plasma to oxidize the solder balls. Film removal; the laser generating device irradiates the solder balls with laser light to melt the solder balls, while the oxide film of the solder balls is removed by the plasma irradiation unit, the solder balls are melted by the laser irradiation unit, and solder bumps are formed on the electrode pads .
priorityDate	2021-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458357694 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID783 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425193155 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23968

Total number of triples: 33.