http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114808046-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d6a6f422b091ba12ea61d4adbf1b0e8e |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 |
| filingDate | 2022-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_427f177e35495ea837e183b61008ae96 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e69b2ddf22884e5f5cc5cee3b8d3102 |
| publicationDate | 2022-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114808046-A |
| titleOfInvention | A kind of high tensile strength copper foil and preparation method thereof |
| abstract | The invention discloses a copper foil with high tensile strength, the copper foil has a tensile strength of more than 800 MPa; the microstructure of the copper foil along the growth direction contains two types of large grains and small grains of different sizes , and the large grains contain nano-twin structure; the large and small grains are surrounded by each other to form a topological arrangement, and the density is greater than 99.99%; and the grains of the copper foil contain sulfur-doped atoms, and the doping concentration is 5~ 50 ppm. The invention also discloses a preparation method of the copper foil with high tensile strength. The electrolysis method is adopted, and an additive containing both ethylene thiourea decomposition products and ethylene thiourea is used in the electrolyte. The ethylene thiourea decomposition product is obtained by cyclic electroplating: the initial electrolyte is used for cyclic electroplating, and the ethylene thiourea decomposition product is formed when the circulation amount reaches 10 times or more of the initial electrolyte amount. The preparation method utilizes the coexistence of the ethylene thiourea decomposition product and the ethylene thiourea to play a synergistic effect in the process of electrodepositing copper foil to improve the tensile strength of the copper foil. |
| priorityDate | 2022-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.