http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114804012-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_01e6e6a33d6161488a9ab5c5e43d2a71 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0228 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00261 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01D11-00 |
| filingDate | 2022-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37f5de5fa408d00e9f35a82766f1887a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b07f5afdc4d2b6074db55d58353fc2d7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac8da54581624b9b8d389802d9f51092 |
| publicationDate | 2022-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114804012-A |
| titleOfInvention | Inertial sensor packaging method and inertial sensor |
| abstract | The present invention provides an inertial sensor packaging method, comprising the steps of: destroying at least one of the first dielectric part of the first bonding surface in the MEMS wafer and the second dielectric part of the second bonding surface in the cover wafer. Si-O bond; align the first bonding surface and the second bonding surface, attach and adsorb them together, so that the first medium part and the second medium part are pre-bonded through dangling keys to obtain a pre-bonded wafer; heat treatment of the pre-bonded wafer, so that the first dielectric part and the second dielectric part, and the first metal in the first bonding surface A permanent bond is achieved by the second metal portion in the second bonding surface. The invention realizes the electrical connection between the bonding surfaces while ensuring the tightness of the MEMS structure, simplifies the process steps, and takes into account high efficiency and high reliability. The present invention also provides an inertial sensor. |
| priorityDate | 2022-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.