| abstract |
An object of the present invention is to provide a resin composition capable of suppressing the arithmetic mean roughness (Ra) of the surface of the insulating layer after roughening treatment to be low, and having excellent copper plating peel strength and stain removability The cured product; and, a resin composition, which can obtain low dielectric loss tangent (Df), elongation at break and excellent copper adhesion strength (copper foil peeling strength) after accelerated environmental test (HAST). solidified. The solution of the present invention is: a resin composition comprising (A) an allyl compound having an alicyclic structure, (B) an epoxy resin and (C) an active ester compound; and, a resin composition, It contains (A) an allyl compound having an alicyclic structure, (B) an epoxy resin, (C) an active ester compound, and (D) an inorganic filler, wherein the nonvolatile content in the resin composition is set to 100 In mass %, content of (C)component is 10 mass % or more, and content of (D)component is 60 mass % or more when making the nonvolatile matter in a resin composition 100 mass %. |