http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114757903-A

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filingDate 2022-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6294cff11a9193cd580c4e9da11f0c7d
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publicationDate 2022-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-114757903-A
titleOfInvention A kind of optical device chip packaging gold wire defect detection method
abstract The invention provides a method for detecting gold wire defects in packaging of optical device chips, belonging to the field of machine vision defect detection. The method includes the following steps: S1 collecting an image of an area block with packaging gold wires on an optical device chip, and obtaining through template matching detection. For the solder joints of the gold wire, S2 extracts the gold wire area based on the solder joint tracing based on the gray mean value and grayscale variance of the area block image of the packaged gold wire to obtain the gold wire area, and S3 compares the extracted gold wire area Perform grayscale analysis and feature calculation to complete gold wire defect detection. The detection method of the invention has fast detection speed and strong robustness.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115049653-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115908242-B
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priorityDate 2022-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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