| abstract |
A wafer structure includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate, which is manufactured by a semiconductor process of at least a 12-inch wafer. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip, which are respectively produced on the chip substrate by a semiconductor process, and are cut into at least one first inkjet chip and at least one second inkjet chip chip. The first inkjet chip and the second inkjet chip respectively include: a plurality of ink drop generators, which are produced on the chip substrate by a semiconductor process, and each ink drop generator includes a thermal barrier layer, a heating resistance layer, and a conductive layer. , protective layer, barrier layer, ink supply chamber and nozzle. |