http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114747025-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_535127fc110f647288d5f9bf42fcc199 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-18 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate | 2020-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4d32b30585b0227d247be65d8b4eae3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74b0ea986cba470251d6ee3cfa4bf172 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb91e5bcf8a1edb22e6df656cc27d950 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4533799ef1ba792320641dbe1df70521 |
| publicationDate | 2022-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114747025-A |
| titleOfInvention | LED light-emitting device and manufacturing method thereof |
| abstract | An LED light-emitting device and a manufacturing method thereof relate to the field of LED technology and are used to solve the technical problems of high cost and poor structural stability of the LED light-emitting device. The LED light-emitting device comprises a carrier (1), the carrier (1) comprises a conductive layer (2); an LED chip (6), the LED chip (6) is arranged on the carrier (1), and an electrode (61) of the LED chip (6) ) flip-chip bonding and conductively connected to the conductive layer (2); wherein the conductive layer (2) comprises a copper layer (5) and a welding area (3) disposed on the copper layer (5), and the welding area (3) Any of the AND electrodes (61) includes a tin layer and does not include gold and nickel. The LED lighting device and the manufacturing method thereof are used for reducing the cost of the LED lighting device and improving the structural stability of the LED lighting device. |
| priorityDate | 2019-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 42.