| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f0c17fb0be15e18e811be589c822b4c8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B2027-0178
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0016 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B27-017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-156 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-15 |
| filingDate |
2020-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7615cb8cdecf2975d02fdfc9ca709a6f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b4f38ba2e6f6c317fa39ee86c19fe07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_734fe4c7980e3722e994c43ed44fcee9 |
| publicationDate |
2022-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-114730791-A |
| titleOfInvention |
LED array with transparent substrate with conductive layer for enhanced current spreading |
| abstract |
In flip-chip LED assemblies with LED arrays formed on the same substrate, the different LEDs of the array have different distances from the n-type contacts of the assembly. This can lead to current crowding as current must spread from the n-type contacts through the substrate to each furthest LED of the LED array, requiring the further LEDs to be driven with higher voltages in order to receive the required amount of current. In order to spread the current more evenly through the LED assembly and reduce the voltage difference between the nearest LED and the farthest LED in the array, a current spread with a conductive material (eg, conductive oxide) is formed on the substrate surface of the LED assembly Floor. The current spreading layer may be a bulk layer or patterned to increase light extraction from the LEDs of the array. |
| priorityDate |
2019-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |