| abstract |
Provides a film package capable of releasing an adhesive film exhibiting excellent adhesiveness even in low-temperature, short-time thermocompression bonding, and capable of suppressing blocking even when the adhesive film is wound for a long time occur. That is, there is provided a film package in which an adhesive film including a release base material and an adhesive bond layer provided on the release base material is wound around a core, wherein the adhesive The agent layer contains (A) a radically polymerizable (meth)acrylic compound, (B) an epoxy resin, and (C) an epoxy resin curing agent, and the component (B) contains a solid epoxy resin at room temperature , the component (C) contains a solid epoxy resin curing agent at room temperature. |