http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114726967-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_58cc76b4bd680b23f5bb7e2793078b81
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N23-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03B17-55
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N23-56
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N23-55
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06V40-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04N5-225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03B17-55
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06V40-16
filingDate 2020-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ceba784a30b4f367523e9c42e289ab7c
publicationDate 2022-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-114726967-A
titleOfInvention Binocular face recognition smart AI camera
abstract The invention discloses a binocular face recognition intelligent AI camera, comprising a front shell, a rear cover, and a camera module arranged between the front cover and the rear cover. The camera module includes a bracket, and the camera modules are respectively arranged on the bracket The first PCBA board and the second PCBA board, the first PCBA board is provided with an infrared sensor and an image sensor, the second PCBA board is provided with a SOC chip, and a UVC interface is connected to the SOC chip, and the SOC chip has a built-in There are an ISP processing unit, a DSP processing unit and a storage unit, the storage units are respectively electrically connected with the ISP processing unit and the DSP processing unit and embedded with SDK, and the infrared sensor and the image sensor are respectively electrically connected with the ISP processing unit of the SOC chip . The binocular face recognition intelligent AI camera provided by the present invention integrates the ISP processing unit in the system chip, which reduces the application cost of customers, and the algorithm is embedded, without consuming the computing power of the main control board, reducing the cost of the main control board and improving the cost performance of the chip. .
priorityDate 2020-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
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http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419484328

Total number of triples: 21.