| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1d6ad716273305b954bea9c820a7b978 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-005 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-799
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-44 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00 |
| filingDate |
2021-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_993132cc01d85dfc3db2e0420a37b499 |
| publicationDate |
2022-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-114695604-A |
| titleOfInvention |
Method of separating multiple LED structures from a wafer |
| abstract |
The present invention relates to a method of separating a plurality of LED structures from a wafer, whereby it is not limited by the presence or absence of a sacrificial layer in the wafer, and the thickness of the semiconductor layer does not need to be specifically designed in advance at the time of wafer fabrication, but can be easily achieved by commercialized wafers And the LED structure of the target size, thickness and shape is separated from the wafer without damage. |
| priorityDate |
2020-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |