| abstract |
An object of the present invention is to provide a curable silicone composition which exhibits excellent thixotropy and reduces shape change or shrinkage during curing. The above problem is solved by a curable silicone composition comprising: (A) an alkenyl group-containing organopolysiloxane having at least two alkenyl groups per molecule; (B) each One molecule of organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicon atoms; (C) an epoxy-containing resinous organopolysiloxane represented by the following average unit formula (I): (R 1 3 SiO 1/2 ) f (R 2 2 SiO 2/2 ) g (R 1 SiO 3/2 ) h (SiO 4/2 ) i (XO 1/2 ) j {In formula (I), each of R 1 are independently halogen-substituted or unsubstituted monovalent hydrocarbon groups, wherein at least two R 1 are alkenyl groups, and R 2 are each independently halogen-substituted or unsubstituted monovalent hydrocarbon groups or epoxy-containing organic groups group, wherein at least one R 2 is an epoxy-containing organic group, X is a hydrogen atom or an alkyl group, 0≤f<1, 0<g<1, 0≤h<0.9, 0≤i<0.5, 0 <j<0.5, f+g+h+i+j=1.0, h+i>0, and j/(f+g+h+i+j)>0.05}; and (D) a catalyst for curing. |