http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114672857-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P10-20 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01G3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2022-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114672857-B |
| titleOfInvention | Preparation method of high-purity copper sulfate and copper electroplating process applied to copper interconnection |
| abstract | The invention discloses a copper electroplating process based on high-purity copper sulfate applied to copper interconnection. The copper electroplating solution in the copper electroplating process includes the following components with the following mass concentrations: high-purity copper sulfate 100-200g/L; concentrated sulfuric acid 120‑150g/L; compound leveling agent 30‑90mg/L; complexing agent 0.05‑0.2g/L; accelerator 0.01‑0.05g/L; brightener 0.5‑0.95g/L; compound synergist 30‑60mg /L; nucleating agent 10-30mg/L. Using the copper electroplating solution of the invention to perform electroplating on the wafer can obtain copper pillars with excellent uniformity, no cracks, fine and bright crystals, and the electroplating efficiency of copper is as high as 92% or more, and the current density range is 0.2-55ASD. |
| priorityDate | 2022-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 96.