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filingDate 2020-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0cf423e4bc53e3fe7dccccd78196e65
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publicationDate 2022-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-114671395-A
titleOfInvention Semiconductor structure and its manufacturing method, MEMS device and electronic equipment
abstract The present invention relates to a semiconductor structure and its manufacturing method, a MEMS device and an electronic device. The semiconductor structure includes: a first substrate having a first defining surface; a second substrate having a second defining surface, and the first defining surface and the second defining surface are opposite to each other; and a metal sealing ring structure arranged on the first defining surface and the second defining surface. Between the two defining surfaces, the sealing ring structure and the first and second defining surfaces define a accommodating space; the MEMS device, the accommodating space is suitable for accommodating the MEMS device, the MEMS device includes an input end, an output end and at least one grounding end, wherein: the grounding end , one of the input end and the output end is an electrical connection end that is electrically connected to the sealing ring structure.
priorityDate 2020-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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