| abstract |
The present invention provides a method for testing a semiconductor component. The main steps include using a yellow light process to fabricate a circuit redistribution layer on the semiconductor component to be tested, and then the test probe does not directly contact the semiconductor component to be tested, but contacts the circuit redistribution layer. The redistribution layer is removed by dry, wet or mechanical polishing process. The invention can improve the testing speed of the semiconductor components, reduce the testing cost, and does not leave test pin marks on the semiconductor components after the test is completed. |