http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114622213-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1c553258afe7ff91d1ac8f1bf84f6e6e |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-26 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-26 |
| filingDate | 2022-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9779a3faabf217a69f093192a2d1e743 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_603a793ce456f5f72d8388668ab6d9a9 |
| publicationDate | 2022-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114622213-A |
| titleOfInvention | An environmentally friendly neutral pickling solution for copper |
| abstract | The invention relates to the field of copper material surface cleaning solution, in particular to an environment-friendly neutral pickling solution for copper materials, comprising the following components: hydroxyethylidene diphosphonic acid, disodium EDTA, dodecylbenzenesulfonic acid Sodium, pH regulator and water; wherein, the pH of the prepared copper material environment-friendly neutral pickling solution is 6 to 7, and hydroxyethylidene diphosphonic acid is used in the prepared copper material environment-friendly neutral pickling solution The concentration in the solution is 15.0-20.0g/L, the concentration of disodium EDTA in the prepared copper material environment-friendly neutral pickling solution is 8.0-10.0g/L, the dodecylbenzenesulfonic acid The concentration of sodium in the prepared copper material environment-friendly neutral pickling solution is 1.0-2.0 g/L. The environmentally friendly neutral pickling solution for copper materials prepared by the invention does not contain heavy metals and other toxic and harmful substances, meets the requirements of green environmental protection, and can be used under neutral conditions to wash away various oxides and oily substances on the surface of copper materials And can improve the corrosion resistance of copper. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115449440-A |
| priorityDate | 2022-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.